Details

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HannYa High Low Temperature Shock Test Chamber Thermal Conductivity Testing Equipment

The thermal shock test chamber is the perfect testing machine of electronic components, metal, chemical materials, automation components, communication module, national defense industry, aerospace industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramic and high polymer materials.

Test standards:

GB11158  GB10589-89  GB10592-89

GB/T10586-89  GB/T2423.22-2001 GB/T2423.1-2001

GB/T2423.2-2001 GB/T2423.3-93 GB/T2423.4-93

ASTM D1735 EIA - 364-59  IEC60068-2-1.1990

IEC60068-2-2.1974 IEC 68-2-30 IEC68-2-03 EIA - 364-31C

Specifications:

Inner Size(mm)	400×350×300	400×500×400	500×600×500	500×750×600
Temperature Range	High temperature chamber:RT~+150°C Low temperature:RT~-60°C
Temperature Deviation	Less than ±2°C
Temperature Conversion Time	Less than 10S
Temperature Recovery Time	Less than 5min
Material	External material: SUS#304 Stainless steel plate Internal material:SUS#304 Stainless steel plate
Coolting System	Water-cooled or air-cooled, Tecumseh compressor in France, Environment friendly refrigerant
Controllor	Programmable temperature controllor
Temperature Sensor	PT 100 *3
Setting Range	TEMPERATURE : -100.00+200.00°C / TIME : OH1M ~ 9999H 59M / CYCLE ~ 10000 CYCLE
Resolution	TEMPERATURE : 0.01°C / TIME : 1 MIN
Output Mode	PID + PWM + SSR CONTROL METHOD
Simulated Load IC (KG)	3.5kg
Standard Accessories	Cable hole, lighting equipment
Cooling System	Water-cooled/air-filled type
Power	AC380V/50HZ Three-phase four-wire ac power
Additional Features	The outlet and return it checks for taste known control /CM BUS (RS-485) remote monitoring management system /Ln2 liquid nitrogen rapid cooling control device
Remarks	It can be customiazed according to customer demands. Technology index refer to product description.Delivery time within 45days

Working Principle

Sample is placed in the test chamber, more extreme temperature than test temperature can be set in high-temperature chamber and low-temperature chamber. When it comes to low temperature test, cold chamber door open, and low-temperature chamber working together with test chamber.

When converted into high-temperature test, cold chamber door closed, hot chamber door are opened, and test chamber working together with high-temperature chamber.

Conversion of mechanical action (transferring from high temperature to low temperature or low temperature to high temperature) can be completed in less than 1second, and the temperature can be quickly stabilized. During the whole test, test sample is no need to be moved, and without any human intervention.

Applications

Thermal Shock Chamber have been designed to operate in accordance with reliability programs, quality control, commercial test programs and medical tests. It is used to test the capability of material structure or composite material to withstand the continuous environmental changes between extremely high temperature and low temperature during a short period. It is applicable to metals, plastic, rubber, electronics amongst other materials. The test result can be used as a reference or basis for produce improvement.

 

Features

• Thermal shork chamber in each zone for peak demand of heating and cooling. Provides extra thermal energy to efficiently meet the MIL-STD 883 requirements.
• Temperature recorder provides 24 hour part temperature recording as the load travels from zone to zone. Using touch-control graph control as operation interface, easy to operate.
• The system can be used for automatic Circulation Shock or manual selective shock, capable of setting two zones or three zones shocks as well as cold and thermal shock start-up.
• Custom-made and optional accessories available.